https://devzone.nordicsemi.com/f/nordic-q-a/10273/nrf51x22-ceaa-reference-designI can not find information about layer stack-up and whether the via-in-pads were filled, please provide this information. We are thinking about a variant with thin outer layers to make the filling of the via-in-pads unnecessary.en-USTelligent Community 13Tue, 17 Nov 2015 10:30:59 GMThttps://devzone.nordicsemi.com/thread/38133?ContentTypeID=1Tue, 17 Nov 2015 10:30:59 GMT137ad170-7792-4731-bb38-c0d22fbe4515:79453be5-fece-4ce0-9b87-ec1f7f4710dbeck<p>Anyway I would like to know which stack up was used for the reference design. Please provide us with this information.</p><div style="clear:both;"></div>https://devzone.nordicsemi.com/thread/38132?ContentTypeID=1Mon, 16 Nov 2015 13:33:24 GMT137ad170-7792-4731-bb38-c0d22fbe4515:21c2d56b-2597-4854-af2b-625c27cd6845Susheel Nuguru<p>Via in pads must be filled. When using a balun, the stack-up doesn’t matter. Just set the second layer as ground.</p><div style="clear:both;"></div>