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<?xml-stylesheet type="text/xsl" href="https://devzone.nordicsemi.com/cfs-file/__key/system/syndication/rss.xsl" media="screen"?><rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:slash="http://purl.org/rss/1.0/modules/slash/" xmlns:wfw="http://wellformedweb.org/CommentAPI/" xmlns:atom="http://www.w3.org/2005/Atom"><channel><title>nan_040.pdf - aQFN Exposed die pad via clarifications</title><link>https://devzone.nordicsemi.com/f/nordic-q-a/104058/nan_040-pdf---aqfn-exposed-die-pad-via-clarifications</link><description>Hi, 
 I believe there are some contradictions regarding the &amp;quot;Exposed die pad vias&amp;quot; in this document : 
 From table 2: - Copper pad diameter: 0.275mm - Exposed die pad via diameter: 0.3mm - Exposed die pad via pitch: 1.2mm 
 This is also inline with the</description><dc:language>en-US</dc:language><generator>Telligent Community 13</generator><lastBuildDate>Mon, 25 Sep 2023 12:07:55 GMT</lastBuildDate><atom:link rel="self" type="application/rss+xml" href="https://devzone.nordicsemi.com/f/nordic-q-a/104058/nan_040-pdf---aqfn-exposed-die-pad-via-clarifications" /><item><title>RE: nan_040.pdf - aQFN Exposed die pad via clarifications</title><link>https://devzone.nordicsemi.com/thread/447473?ContentTypeID=1</link><pubDate>Mon, 25 Sep 2023 12:07:55 GMT</pubDate><guid isPermaLink="false">137ad170-7792-4731-bb38-c0d22fbe4515:a909a372-2686-4a9c-a779-c62f601172b8</guid><dc:creator>ketiljo</dc:creator><description>&lt;p&gt;The vias in the pads are micro vias and can only extend from the top layer to the next layer. The vias in the center pads extends to all layers and much hence be larger. You can use any size here. Capped or filled vias are preferred.&lt;/p&gt;&lt;div style="clear:both;"&gt;&lt;/div&gt;</description></item></channel></rss>