Problem Loading Bonding Info From Flash

RE: Problem Loading Bonding Info From Flash

David Gunderson — Wed, 05 Mar 2014 20:29:04 GMT

I've confirmed that this was an isolated hardware issue on the nRF51822 mounted to the Fujitsu DK. This morning, I got another Fujitsu module working with the same code and there are no problems in with memory faults.

RE: Problem Loading Bonding Info From Flash

Ole Morten — Wed, 05 Mar 2014 10:21:46 GMT

As I said above, if you see the exact same symptoms as him (region 1: 4096 kB), this seems to indicate some kind of chip failure. Please create a support case, making sure to supply a screenshot of nRFgo Studio and the complete chip markings.

RE: Problem Loading Bonding Info From Flash

David Gunderson — Fri, 28 Feb 2014 22:52:43 GMT

I have the same issue on the nRF51822-QFAAFA in a Fujitsu module attached to their development kit board. Using the latest S110 and SDK 6.0.0. Did this issue ever get resolved?

RE: Problem Loading Bonding Info From Flash

Ole Morten — Fri, 06 Dec 2013 15:40:56 GMT

Based on your latest studio screenshot, it seems there is something odd about your chip (region 1: 4096 kB is not correct). Please create a support case and refer to this thread, and I'll make sure it is handled as soon as possible.

RE: Problem Loading Bonding Info From Flash

Eric — Fri, 06 Dec 2013 15:34:37 GMT

I'm using version 6.0.0.5 of the soft device, attached is a screen shot from nRFgo Studio with the verification.

The markings on the chip read:

N51822
QFAAFA
1319AA

The sticker on the PCB reads:

PCA10004
Rev. 2.1.0
2013.25
10001609

RE: Problem Loading Bonding Info From Flash

Ole Morten — Fri, 06 Dec 2013 15:17:47 GMT

I just tried to reproduce this, with the project and hex you uploaded, but I'm not able to. The values for the memcpy() parameters also looks good in your screenshot, but I find it strange that you don't get a backtrace from your HardFault. Can you please make sure that you use softdevice 6.0.0, which is required for SDK 5.0.0? Also, can you please read off the laser markings on your chip, and post them?

RE: Problem Loading Bonding Info From Flash

Eric — Fri, 06 Dec 2013 14:44:01 GMT

Attached is a screen shot with the stack at HardFault, also a stack just before the memcpy that causes the HardFault.

I get this fault with all the ble projects at the moment. Those screen shots are from an unmodifed copy of ble_app_proximity (well I changed the optimisation so the stack trace has more info for the second screen shot).

ble_app_proximity.7z

RE: Problem Loading Bonding Info From Flash

Ole Morten — Thu, 05 Dec 2013 11:47:17 GMT

A HardFault can be caused by a number of different reasons, but one of them is unaligned access. Even though the line above the one you quote is supposed to catch this, can you please check what the pointer values are at the point where you suspect it fails?

Also, even when you get a HardFault, you should be able to see a backtrace to the point that caused it with version 6.0.0 of the softdevice. What do you see in the call stack window when you put a breakpoint in the HardFault handler?

A HardFault is also what will happen if you try to do an operation that the MPU forbids, or try to access flash/RAM outside the valid areas. This does however seem unlikely in this case, unless you have very strange values for the flash pages used for bonds and system attributes, but it could be worth checking.

If you still have trouble, could you please share your complete project? As normal, if you need confidentiality, please create a support case on our regular web site.

Edit: Rephrased somewhat in first and third paragraph.