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<?xml-stylesheet type="text/xsl" href="https://devzone.nordicsemi.com/cfs-file/__key/system/syndication/rss.xsl" media="screen"?><rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:slash="http://purl.org/rss/1.0/modules/slash/" xmlns:wfw="http://wellformedweb.org/CommentAPI/" xmlns:atom="http://www.w3.org/2005/Atom"><channel><title>Changing stack-up layers in designing nRF52832 with CSP package</title><link>https://devzone.nordicsemi.com/f/nordic-q-a/11198/changing-stack-up-layers-in-designing-nrf52832-with-csp-package</link><description>Hi guys, 
 I have a question when design the pcb layout stack with nRF52832, CSP package (CHAA). As recommendation from Nordic, using 4 layers will give best performance but is it ok if I change to use just 2 layers intead of 4 layers? 
 Here is my</description><dc:language>en-US</dc:language><generator>Telligent Community 13</generator><lastBuildDate>Fri, 08 Jan 2016 13:17:58 GMT</lastBuildDate><atom:link rel="self" type="application/rss+xml" href="https://devzone.nordicsemi.com/f/nordic-q-a/11198/changing-stack-up-layers-in-designing-nrf52832-with-csp-package" /><item><title>RE: Changing stack-up layers in designing nRF52832 with CSP package</title><link>https://devzone.nordicsemi.com/thread/41949?ContentTypeID=1</link><pubDate>Fri, 08 Jan 2016 13:17:58 GMT</pubDate><guid isPermaLink="false">137ad170-7792-4731-bb38-c0d22fbe4515:dcc99f72-bbcc-480b-9014-818abb3463f8</guid><dc:creator>Ole Bauck</dc:creator><description>&lt;p&gt;The recommendation for 4 layers is to be able to route out all pins, not to get better radio performance. In a 4 layer board, the two top and bottom layers are close to each other which allows microvias to be placed, which will make it possible to route out the inner balls. In your case the two layers are close so you will probably be able to do the same. If you are able to make the board with 2 layers, there is no problem with using that.&lt;/p&gt;&lt;div style="clear:both;"&gt;&lt;/div&gt;</description></item></channel></rss>