https://devzone.nordicsemi.com/f/nordic-q-a/124134/solder-voids-under-aqfn-nrf52840Hi We have just been notified by our supplier that they have detected som anomalies when taking X-ray images after soldering our 208 pcb&#39;s. they estimate around 25% will have unconnected pins. Figure1 is what our supplier calls normal. And figureen-USTelligent Community 13Tue, 16 Sep 2025 07:31:04 GMThttps://devzone.nordicsemi.com/thread/548822?ContentTypeID=1Tue, 16 Sep 2025 07:31:04 GMT137ad170-7792-4731-bb38-c0d22fbe4515:25146b22-0c97-4d4e-a743-4423a200a016ketiljo<p>Seems like vias in the center pad aren&#39;t filled, but that should be ok. Check the thickness of the stencil and increase it if it&#39;s too thin.&nbsp;</p><div style="clear:both;"></div>https://devzone.nordicsemi.com/thread/548685?ContentTypeID=1Mon, 15 Sep 2025 06:53:09 GMT137ad170-7792-4731-bb38-c0d22fbe4515:eb0c6d0c-25bd-49a0-8d0d-cb7da548d516Wuup<p>Thanks, Yes forgot to mention that our vias also was filled with resin, to avoid wicking of solder. But still I&#39;m surprised by the number of voids.</p><div style="clear:both;"></div>https://devzone.nordicsemi.com/thread/547730?ContentTypeID=1Thu, 04 Sep 2025 09:18:57 GMT137ad170-7792-4731-bb38-c0d22fbe4515:322bd28e-93ca-4296-b0d8-c4592b210efcketiljo<p>We&#39;re using your option A on the nRF52840-DK and other design with this device. But as far as I know, the vias are filled and plated to avoid the wicking effect of the vias. This is more important for vias in the pads than the center pad vias. 80 µm stencil thickness.</p> <p>The center pad looks in you pictures. But make sure the voids in the pads aren&#39;t getting any larger:&nbsp;</p> <p><img style="max-height:240px;max-width:320px;" src="https://devzone.nordicsemi.com/resized-image/__size/640x480/__key/communityserver-discussions-components-files/4/pastedimage1756977302623v1.png" alt=" " /></p> <p>Work with the supplier with this, they know their process best.</p><div style="clear:both;"></div>