https://devzone.nordicsemi.com/f/nordic-q-a/1256/nrf24l01-ground-die-padHi, I am creating a PCB design and am not sure if I should connect the pad under the nRF24L01+ to the ground plane with a couple of vias. The data sheet says it should be left unconnected, however it then later shows an example where the ground dieen-USTelligent Community 13Sat, 04 Jan 2014 11:34:50 GMThttps://devzone.nordicsemi.com/thread/5797?ContentTypeID=1Sat, 04 Jan 2014 11:34:50 GMT137ad170-7792-4731-bb38-c0d22fbe4515:11e33639-dc0a-4304-96c0-b091e1de9580Philip<p>Thanks for the reply JT.</p> <p>That makes sense, although why not just not remove the via&#39;s so that you can solder to the pad for mechanical strength?</p> <p>Maybe people have found it solders better without solder on the centre pad.</p> <p>Cheers Phil</p><div style="clear:both;"></div>https://devzone.nordicsemi.com/thread/5796?ContentTypeID=1Sat, 04 Jan 2014 02:56:50 GMT137ad170-7792-4731-bb38-c0d22fbe4515:3d92c2eb-ac3d-4419-9832-24e798c28a36Jay Tyzzer<p>Hello Phillip,</p> <p>The ground pad under the nRF24L01P has connecting vias coming up thru the board from the bottom layer containing ground. It is recommended that this ground pad be covered with solder mask to keep it isolated from the ground lug on the nRF24L01P. With that said, I have heard of others soldering it down without any reported issues. I would go with the recommendation from Nordic to keep it isolated.</p> <p>This is not the case with some of the other chips that Nordic provides and should be looked at device by device.</p> <p>Regards,</p> <p>JT</p><div style="clear:both;"></div>