https://devzone.nordicsemi.com/f/nordic-q-a/125611/nrf5340-claa-solder-processWe have a manufacturing project assembling the 0.35mm CSP package. We would like guidance on part handling, solder stencil specifications and any other process steps that impact the solderability of the fine pitch package.en-USTelligent Community 13Mon, 17 Nov 2025 14:31:22 GMThttps://devzone.nordicsemi.com/thread/554557?ContentTypeID=1Mon, 17 Nov 2025 14:31:22 GMT137ad170-7792-4731-bb38-c0d22fbe4515:80870332-71fd-47c6-a2f2-7dbce4ea2062Bendik Heiskel<p>Hi,</p> <p>For the WLCSP package we have a handeling guidelines whitepaper available here:<br /><a href="https://docs.nordicsemi.com/bundle/nan_38/resource/nan_38.pdf">https://docs.nordicsemi.com/bundle/nan_38/resource/nan_38.pdf</a></p> <p>We don&#39;t have any specific solder stencil requirements, as this is heavily dependent on the process used by your PCB manufacturer. For our DKs and internal test boards we rely on the expertise of the&nbsp; manufacturers we&#39;re using, and let them handle modifying the solder stencil for the process they are using. For reference our manufacturers are usually using 80 - 100 um stencils.</p> <p>&nbsp;</p> <p>Best regards,</p> <p>Bendik</p><div style="clear:both;"></div>