https://devzone.nordicsemi.com/f/nordic-q-a/128939/nrf54l15-caxx-wlcsp-package-solder-ballsI have a question regarding the solder balls on the WLCSP package of this device. Are they collapsing or non-collapsing? Can you also provide a definitive source for this answer?en-USTelligent Community 13Fri, 14 Aug 2026 10:37:50 GMThttps://devzone.nordicsemi.com/thread/570254?ContentTypeID=1Fri, 14 Aug 2026 10:37:50 GMT137ad170-7792-4731-bb38-c0d22fbe4515:92f47b6e-828b-42d6-b7cb-a5069bfde6dcPriyanka<p>I think you need to follow the reference design recommendations for these.</p> <p>Nevertheless I will check this as well with the team.</p> <p>-Priyanka</p><div style="clear:both;"></div>https://devzone.nordicsemi.com/thread/570177?ContentTypeID=1Wed, 12 Aug 2026 16:41:05 GMT137ad170-7792-4731-bb38-c0d22fbe4515:3258bac9-0a45-430f-9ceb-25902ffb2269Cindy K<p>Many thanks, Priyanka. We are interested in the possibility that there is a reflow profile that keeps the balls from collapsing,&nbsp;</p> <p>Do we need to follow the reference design in regard to the size of the BGA pads, or is it&nbsp;permissible to enlarge them (to 8.5 mils in this instance)?</p><div style="clear:both;"></div>https://devzone.nordicsemi.com/thread/570139?ContentTypeID=1Wed, 12 Aug 2026 08:13:47 GMT137ad170-7792-4731-bb38-c0d22fbe4515:3e27a204-6996-4069-8ae0-d31512bb7772Priyanka<p>Hi Cindy,</p> <p>I am checking this internally and will get back to you.</p> <p>-Priyanka</p><div style="clear:both;"></div>