https://devzone.nordicsemi.com/f/nordic-q-a/13905/high-temperature-survival-during-device-manufacturingHi, We are currently considering the packaging design of a device which will use a nRF52. During housing assembly, the populated, but unpowered, PCB will be exposed to a temperature of 170&#176;C during 30 minutes. This is higher than the absolute maximumen-USTelligent Community 13Wed, 18 May 2016 08:37:14 GMThttps://devzone.nordicsemi.com/thread/53146?ContentTypeID=1Wed, 18 May 2016 08:37:14 GMT137ad170-7792-4731-bb38-c0d22fbe4515:7ca43934-5060-43cb-a1e4-2d43e12bd8e0run_ar<p>You can find our QFN soldering guidelines <a href="http://infocenter.nordicsemi.com/topic/com.nordic.infocenter.appnotes/dita/appnotes/pdflinks/nan_400-08.html">here</a>. And our WLCSP Handling guidelines <a href="http://infocenter.nordicsemi.com/topic/com.nordic.infocenter.appnotes/dita/appnotes/pdflinks/nan_38.html?cp=11_0">here</a>. Exposing the device to high temperatures outside of what is described in these documents is out of spec, and we cannot guarantee for their operation anymore.</p><div style="clear:both;"></div>