Soldering BAL-NRF01D3

RE: Soldering BAL-NRF01D3

Oleh — Wed, 12 Feb 2014 14:47:32 GMT

Richard thank you for your reply.

I must have had a blackout: have read this AN, but at some point...

Thank you! with best regards Oleh

RE: Soldering BAL-NRF01D3

RENARD — Wed, 12 Feb 2014 11:29:28 GMT

Hello,

You can also have a look to application note AN2348 on www.st.com, which gives soldering recommandations.

Best Regards Richard

RE: Soldering BAL-NRF01D3

Oleh — Mon, 10 Feb 2014 13:01:48 GMT

Dear Janek,

thank you for your advice and answer!

The PCB is ENIG-surfaced. Will try it again!

Thanks&Cheers Oleh

RE: Soldering BAL-NRF01D3

Janek Mann — Mon, 10 Feb 2014 12:31:38 GMT

That would be normal for a BGA/WLCSP device, the balls will collapse when soldered. For prototypes I would just put flux on the pads rather than using solder paste as it's easy to get shorts when using solder paste for small pitch BGA devices. Also, use ENIG surface PCBs rather than HASL, the uneven surface level with HASL can make the soldering very unreliable.