https://devzone.nordicsemi.com/f/nordic-q-a/16218/nrf51822-custom-pcb-layout-helpI am using the nfr51 dk and a standalone nrf51822 based ble module for prototyping &amp; testing purpose.I plan to make my own custom pcb for final production.In both the above boards, i have observed that the components around the radio have been placeden-USTelligent Community 13Mon, 12 Sep 2016 10:20:44 GMThttps://devzone.nordicsemi.com/thread/61940?ContentTypeID=1Mon, 12 Sep 2016 10:20:44 GMT137ad170-7792-4731-bb38-c0d22fbe4515:582ddf49-41a9-481c-9f45-654e3a265ff0Ole Bauck<p>A good connection between the two ground planes is important. The reason there are so many vias is probably this rather than heat dissipation.</p><div style="clear:both;"></div>https://devzone.nordicsemi.com/thread/61939?ContentTypeID=1Fri, 09 Sep 2016 03:34:08 GMT137ad170-7792-4731-bb38-c0d22fbe4515:eca3ec1b-dc5a-4ed6-b517-4ce4c7b08a28Punit<p>ok, one more question, i could also see a lot of thermal vias below the radio chip &amp; the antenna in the third party module, but not in the nrf51dk,... any specific reason apart from heat dissipation for adding those?</p><div style="clear:both;"></div>https://devzone.nordicsemi.com/thread/61938?ContentTypeID=1Wed, 07 Sep 2016 13:01:45 GMT137ad170-7792-4731-bb38-c0d22fbe4515:17c5a814-81d4-448d-8b15-41197aa0799bOle Bauck<p>There is a specific reason for that the components are placed like they are, and that is that this design is optimized to give the best radio performance. The DK (and probably the BLE module) is based on the reference layout found <a href="http://infocenter.nordicsemi.com/topic/com.nordic.infocenter.nrf51/dita/nrf51/pdflinks/ref_layout.html?cp=3_5">here</a>. <strong>All customers should use this reference layout unless it is absolute necessary to not do so</strong>.</p> <p>For example, changing the size of the components and/or the side the components are on will greatly affect the inductance of the matching network.</p><div style="clear:both;"></div>