https://devzone.nordicsemi.com/f/nordic-q-a/18622/nrf52832-ciaa-reference-design-footprint-manufacturabilityHello, We recently sent a design to our board assembly house for review and they indicated that the large copper area under the nRF528323-CIAA (WLCSP) may result in head-in-pillow or cold solder joints. There reference design specifies a copperen-USTelligent Community 13Sun, 05 Jul 2020 18:56:52 GMThttps://devzone.nordicsemi.com/thread/258472?ContentTypeID=1Sun, 05 Jul 2020 18:56:52 GMT137ad170-7792-4731-bb38-c0d22fbe4515:4f30f78d-953d-48a5-ba0b-72bb464fe8c1Nickolas<p>Did it work ?</p><div style="clear:both;"></div>https://devzone.nordicsemi.com/thread/159502?ContentTypeID=1Thu, 29 Nov 2018 08:51:39 GMT137ad170-7792-4731-bb38-c0d22fbe4515:c9775a31-1229-4405-b02e-aefac25fb182kemalserkan<p><img src="https://devzone.nordicsemi.com/resized-image/__size/320x240/__key/communityserver-discussions-components-files/4/pastedimage1543481302372v1.png" alt=" " /></p> <p></p> <p>I am using dcc pin(b6). To connect b6 ball to the ınductors i am using b3,b4,b5,and a3 balls that is not connected to any components or tracks. Can i use like this?&nbsp;</p><div style="clear:both;"></div>https://devzone.nordicsemi.com/thread/71902?ContentTypeID=1Mon, 09 Jan 2017 09:12:40 GMT137ad170-7792-4731-bb38-c0d22fbe4515:daa23393-e1ea-4a31-9856-1e5e5ee2302bFormerMember<p>The copper area is mainly to get as god ground connection as possible. Heat dissipation is not a problem since the power is relatively low.</p> <p>It doesn&#39;t matter how you connect the balls to ground, as long as you do so. You can use NC balls (they are not connected to anything) to route signals or ground through if that helps routing.</p><div style="clear:both;"></div>