NRF52840 package layouthttps://devzone.nordicsemi.com/f/nordic-q-a/23074/nrf52840-package-layoutHello, In the reference layout for NRF52840 package (QIAA), the shape defined in the SOLDER PASTE is a bit larger than the one defined on TOP LAYER (copper) for each terminal pad. Is it normal and what&#39;s the point of it ?en-USTelligent Community 13Fri, 30 Jun 2017 12:33:28 GMTRE: NRF52840 package layouthttps://devzone.nordicsemi.com/thread/90800?ContentTypeID=1Fri, 30 Jun 2017 12:33:28 GMT137ad170-7792-4731-bb38-c0d22fbe4515:c40f7c9b-014a-44bb-9353-24419a653e81FormerMember<p>The reference layout is correct, the solder paste has to be larger than the top copper to avoid that the solder paste covers the copper. It can be useful to have a look at <a href="https://macrofab.com/blog/bga-pad-creation-smd-nsmd/">this</a> &quot;blog&quot; post regarding the same topic.</p><div style="clear:both;"></div>