Procedure difference of Bluetooth SIG exists when using BLE module/creating custom PCBs?

RE: Procedure difference of Bluetooth SIG exists when using BLE module/creating custom PCBs?

Hung Bui — Wed, 29 Nov 2017 09:33:01 GMT

Hi Matthew, There are 2 things here. The DID declaration fee and the RF-PHY retest.

You will have to pay DID fee when you use the module regardless how you use it as it mentioned in Bluetooth Sig page that I quoted.

The RF-PHY re-test, if the module is sealed and the radio part on the module is completely separated from the customized part (as seen on the picture you provided), I don't think RF-PHY retest is needed. But I'm not sure about FCC as you may need to test it as fully assembled with housing, etc.

I don't think Bluetooth Sig qualification has anything to do with custom clearance, CE and FCC maybe more relevant.

RE: Procedure difference of Bluetooth SIG exists when using BLE module/creating custom PCBs?

Matthew K — Wed, 29 Nov 2017 02:08:18 GMT

Thanks, Dave~ Unfortunately, I'm doing a B2C project. These RC car products (PCB and mold) will be manufactured from Shenzhen, China. Also, I received an import customs clearance issue that without the SIG certification (a paper showing Declaration of Compliance, Supplier Declaration of Conformity, etc) these products cannot be shipped so I started to dig the SIG webpage and the devzone. Have you heard about any issues related to SIG and import customs clearance issue? I'm checking this because the Testing Certification companies are talking this issue but I felt like this is a unilateral assertion to rip off money. Thanks for your time~

RE: Procedure difference of Bluetooth SIG exists when using BLE module/creating custom PCBs?

Matthew K — Wed, 29 Nov 2017 01:48:48 GMT

Anyways, thanks for your sincere answer Hung. I'm reading the Infocenter and I have one more to ask!

You do not need to qualify your design if you are using an already qualified Bluetooth design. You still need to pay the declaration fee and declare your product. (Ref. SIG guide)

Using someone else's Bluetooth module in your product without any changes or additions Adding your logo to a complete product manufactured by a third party

I wish to ask about the changes or additions. Just like the example picture above, a Laird's BLE module is mounted on a custom PCB. I'm trying to do something like this, too. Does this count as an addition to the Bluetooth module? Or are you meaning about soldering some chip or changing the antenna chip on the Laird's BLE module? Thanks for your time!!!

RE: Procedure difference of Bluetooth SIG exists when using BLE module/creating custom PCBs?

Matthew K — Wed, 29 Nov 2017 01:38:53 GMT

Hi, Hung~ Thanks for your time! Looks like you are mentioning the BLE QDID matrix table. I use SoftDevice 5 and nRF52832 so the info of this End Product is QDID 97989, Declaration ID D034946. I haven't heard about the discounted price when the RF-PHY retest is exempted, but it looks like it would be better for me to create my own custom BLE PCB, hmm. Since the Segger chip and headers are not used, looks like I cannot get away from the RF-PHY retest. Lastly, I'm not in a start-up company so the incentive program is not feasible. Looks like my company as to be whether an Associate/Adopter SIG member, right?

RE: Procedure difference of Bluetooth SIG exists when using BLE module/creating custom PCBs?

Dave_couling — Tue, 28 Nov 2017 23:51:07 GMT

Unless you don't want to have the Bluetooth logo on your packaging. If its a B2B product i think you can skip it.

RE: Procedure difference of Bluetooth SIG exists when using BLE module/creating custom PCBs?

Hung Bui — Tue, 28 Nov 2017 15:25:19 GMT

Hi Matthew,

I don't think you can get away from paying Bluetooth SIG to get Declaration ID by using Laird module. As stated here and here:

Path 1: Qualification Process with No Required Testing (Declaration Process):
Using someone else's Bluetooth module in your product without any changes or additions 
Adding your logo to a complete product manufactured by a third party

You may not need to do RF-PHY retest if you use the module. When you develop your own PCB, you will need to do RF-PHY retest, but not other qualification that we already provided with our QDID.

You only can get away from RF-PHY retest if you use exactly the same PCB as the nRF52 DK, including other components such as the Segger chip and headers, etc.

If your company is a start up and has a total revenue of less than $1mil you can apply for Innovation Incentive Program and pay less fee for qualification.

Also be aware that you can declare multiple product in one DID. Please check the Bluetooth Sig web page.