<?xml version="1.0" encoding="UTF-8" ?>
<?xml-stylesheet type="text/xsl" href="https://devzone.nordicsemi.com/cfs-file/__key/system/syndication/rss.xsl" media="screen"?><rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:slash="http://purl.org/rss/1.0/modules/slash/" xmlns:wfw="http://wellformedweb.org/CommentAPI/" xmlns:atom="http://www.w3.org/2005/Atom"><channel><title>NRF2402 pad</title><link>https://devzone.nordicsemi.com/f/nordic-q-a/3872/nrf2402-pad</link><description>Hello,
I am creating a PCB design for NRF2402AG but I&amp;#39;m not sure whether I should connect pad under the NRF to the ground or I should left them isolated. I could not found any information about in the data sheet.
Thanks.</description><dc:language>en-US</dc:language><generator>Telligent Community 13</generator><lastBuildDate>Mon, 22 Sep 2014 07:57:49 GMT</lastBuildDate><atom:link rel="self" type="application/rss+xml" href="https://devzone.nordicsemi.com/f/nordic-q-a/3872/nrf2402-pad" /><item><title>RE: NRF2402 pad</title><link>https://devzone.nordicsemi.com/thread/13942?ContentTypeID=1</link><pubDate>Mon, 22 Sep 2014 07:57:49 GMT</pubDate><guid isPermaLink="false">137ad170-7792-4731-bb38-c0d22fbe4515:947661de-1cf4-4316-8775-40714faf20f3</guid><dc:creator>Asbj&amp;#248;rn</dc:creator><description>&lt;p&gt;On the nRF2402 it is recommended not to solder the bottom die pad to the PCB ground. This is to prevent noise from entering the chip through GND.&lt;/p&gt;&lt;div style="clear:both;"&gt;&lt;/div&gt;</description></item></channel></rss>