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<?xml-stylesheet type="text/xsl" href="https://devzone.nordicsemi.com/cfs-file/__key/system/syndication/rss.xsl" media="screen"?><rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:slash="http://purl.org/rss/1.0/modules/slash/" xmlns:wfw="http://wellformedweb.org/CommentAPI/" xmlns:atom="http://www.w3.org/2005/Atom"><channel><title>Save bonding information on Application Chip</title><link>https://devzone.nordicsemi.com/f/nordic-q-a/38824/save-bonding-information-on-application-chip</link><description>Hi there, 
 
 We have the application running on STM32 and we talk to connectivity chip ( nrf 52810) using serialization. 
 Now, I have to save bonding information on my STM32 (various reason). So I can rule out the use of Peer Manager . 
 
 
 
 
 
 The</description><dc:language>en-US</dc:language><generator>Telligent Community 13</generator><lastBuildDate>Wed, 26 Sep 2018 06:14:29 GMT</lastBuildDate><atom:link rel="self" type="application/rss+xml" href="https://devzone.nordicsemi.com/f/nordic-q-a/38824/save-bonding-information-on-application-chip" /><item><title>RE: Save bonding information on Application Chip</title><link>https://devzone.nordicsemi.com/thread/150362?ContentTypeID=1</link><pubDate>Wed, 26 Sep 2018 06:14:29 GMT</pubDate><guid isPermaLink="false">137ad170-7792-4731-bb38-c0d22fbe4515:6b0804a4-0a23-4d5d-a842-4103d1907161</guid><dc:creator>Satbir</dc:creator><description>&lt;p&gt;Thanks Kenneth,&lt;/p&gt;
&lt;p&gt;It worked, I realized that I missed a few flags&lt;/p&gt;
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&lt;div&gt;&lt;span&gt;kdist_own&lt;/span&gt;&lt;span&gt;.&lt;/span&gt;&lt;span&gt;enc&lt;/span&gt;&lt;span&gt; &lt;/span&gt;&lt;span&gt;=&lt;/span&gt;&lt;span&gt; &lt;/span&gt;&lt;span&gt;1&lt;/span&gt;&lt;/div&gt;
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&lt;div&gt;&lt;span&gt;kdist_peer&lt;/span&gt;&lt;span&gt;.&lt;/span&gt;&lt;span&gt;enc&lt;/span&gt;&lt;span&gt; &lt;/span&gt;&lt;span&gt;=&lt;/span&gt;&lt;span&gt; &lt;/span&gt;&lt;span&gt;1&lt;/span&gt;&lt;/div&gt;
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&lt;div&gt;&lt;span&gt;Thanks again.&lt;/span&gt;&lt;/div&gt;
&lt;/div&gt;&lt;div style="clear:both;"&gt;&lt;/div&gt;</description></item><item><title>RE: Save bonding information on Application Chip</title><link>https://devzone.nordicsemi.com/thread/150239?ContentTypeID=1</link><pubDate>Tue, 25 Sep 2018 11:53:12 GMT</pubDate><guid isPermaLink="false">137ad170-7792-4731-bb38-c0d22fbe4515:69b651ea-41cb-4c97-8991-9a3bd572d810</guid><dc:creator>Kenneth</dc:creator><description>&lt;p&gt;Hi,&lt;/p&gt;
&lt;p&gt;You serialize softdevice api, so sd_ble_gap_sec_params_reply() and&amp;nbsp;sd_ble_gap_sec_info_reply() should not differ from other softdevice api calls and events.&lt;/p&gt;
&lt;p&gt;I do for instance believe&amp;nbsp;\nRF5_SDK_15.2.0_9412b96\examples\ble_peripheral\ble_app_hrs\pca10040\ser_s132_uart show usage of&amp;nbsp;&lt;span&gt;sd_ble_gap_sec_params_reply() and sd_ble_gap_sec_info_reply().&lt;/span&gt;&lt;/p&gt;
&lt;p&gt;Best regards,&lt;br /&gt;Kenneth&lt;/p&gt;&lt;div style="clear:both;"&gt;&lt;/div&gt;</description></item></channel></rss>