nrf51822 Beacon HW: Now with black goop!

RE: nrf51822 Beacon HW: Now with black goop!

Petter Myhre — Fri, 24 Oct 2014 13:22:57 GMT

Section 7.1 in the nRF51822 Product Specification states: "The WLCSP package variant is sensitive to visible and near infrared light which means a final product design must shield the chip properly. The marking side is covered with a light absorbing film, while the side edges of the chip and the ball side must be protected by coating or other means."

This "black goop" is this "coating or other means".

It is not supposed to cover the pins. If you need pin 5, you can try to scratch it off pin 5, but I can't say it is safe. Please be careful.

RE: nrf51822 Beacon HW: Now with black goop!

Jerod — Thu, 02 Oct 2014 19:25:46 GMT

I suspect you're right, but want to understand from Nordic's PoV whether this is needed/required/suggested or why suddenly their HW is shipping like this.

RE: nrf51822 Beacon HW: Now with black goop!

John — Thu, 02 Oct 2014 12:41:20 GMT

Would it be possible to post pictures of the old non-gooped beacon and the new gooped beacon? Not that I can help, just very curious.

RE: nrf51822 Beacon HW: Now with black goop!

Adam — Wed, 01 Oct 2014 20:32:07 GMT

I'm not sure but chip encapsulation is usually used to protect against environmental influences e.g.: humidity, corrosion and mechanical stresses (temperature fluctuations, vibrations).