aQFN73 footprint

RE: aQFN73 footprint

suri — Fri, 13 Jan 2023 03:42:55 GMT

Advanced Quad Flat No-lead (aQFN) is a leadless, multi-row, fine pitch lead structure packaging service. With a reduced account and also small footprint, aQFN is a light weight, free-form I/O design which offers itself to boosted thermal and also electric efficiency. The aQFN bundle has a considerable expense advantage due to its affordable products and less complex product packaging procedure. vampire survivors

RE: aQFN73 footprint

Hallvard@Vitir — Wed, 09 Oct 2019 12:15:07 GMT

Thanks, Andreas, I found all info needed in the link you sent. Great!
Best regards, Hallvard

RE: aQFN73 footprint

Andreas — Wed, 09 Oct 2019 06:48:12 GMT

Hi,

This Application note (html and PDF) shows general PCB guidelines for the aQFN package, in case you have not seen that. It should describe our reference pad diameter, pad paste mask diameter and pad solder mask diameter.

There are no balls on the pins of the aQFN package, meaning it is more a LGA style than BGA style.

Best regards,

Andreas