Pairing issue | 0x3D MIC failure error

RE: Pairing issue | 0x3D MIC failure error

Sigurd — Fri, 06 Dec 2019 11:41:50 GMT

[quote user="Samarth"]I found the below link and it seemed to solve the issue. [/quote]

Great!

[quote user="Samarth"]I wonder why though? Would you know anything in this regard?[/quote]

Likely an issue with the phone, happening internally in the Bluetooth stack on the phone. A sniffer trace comparing 900ms vs 400ms delay timer might give us some clues, but since this is happening internally on the phone, it’s difficult to say exactly why it’s not able to handle the request at 400ms.

RE: Pairing issue | 0x3D MIC failure error

SK — Fri, 06 Dec 2019 09:24:16 GMT

Hi,

I found the below link and it seemed to solve the issue.

https://devzone.nordicsemi.com/f/nordic-q-a/40412/android-phone-loses-bonding-information-when-trying-to-read-characteristic

Changing the delay timer to 900 ms from 400 ms.

I wonder why though? Would you know anything in this regard? Also, i migrated my SDK from 14.2 to 15.3. Thought that might resolve the issue. But it was the security delay timer.

RE: Pairing issue | 0x3D MIC failure error

SK — Tue, 26 Nov 2019 07:09:37 GMT

Hi,

Sorry i was not able to check on it before. Will do so and update you soonest.

RE: Pairing issue | 0x3D MIC failure error

Sigurd — Thu, 07 Nov 2019 18:15:37 GMT

[quote user="Samarth"]Would you say that i am using correct params here?[/quote]

Yes, they seem to be fine. Could you check if you are able to reproduce the beahaior with the phone, using the ble_app_gls example in the SDK ? (set SEC_PARAM_LESC to 0).

RE: Pairing issue | 0x3D MIC failure error

SK — Wed, 06 Nov 2019 01:28:35 GMT

Also, i am using a static passkey feature for which BLE_GAP_IO_CAPS_DISPLAY_ONLY has been used.

RE: Pairing issue | 0x3D MIC failure error

SK — Wed, 06 Nov 2019 01:25:20 GMT

Recently it started with S9+ actually. It was not happening before (4-5 months into development).

We are using a test phone provided by TP-Link (neffos C9A) which has given consistently same issue.

Security parameters used are as follows:

    // Security parameters to be used for all security procedures.
    stSecParam.bond           = SEC_PARAM_BOND; //1
    stSecParam.mitm           = SEC_PARAM_MITM; //1
    stSecParam.lesc           = SEC_PARAM_LESC;  //0
    stSecParam.keypress       = SEC_PARAM_KEYPRESS; //0
    stSecParam.io_caps        = SEC_PARAM_IO_CAPABILITIES; //BLE_GAP_IO_CAPS_DISPLAY_ONLY
    stSecParam.oob            = SEC_PARAM_OOB; //0
    stSecParam.min_key_size   = SEC_PARAM_MIN_KEY_SIZE; //7
    stSecParam.max_key_size   = SEC_PARAM_MAX_KEY_SIZE; //16
    stSecParam.kdist_own.enc  = 1;
    stSecParam.kdist_own.id   = 1;
    stSecParam.kdist_peer.enc = 1;
    stSecParam.kdist_peer.id  = 1;

Would you say that i am using correct params here? I will check out the link also that you gave. thanks!

RE: Pairing issue | 0x3D MIC failure error

Sigurd — Tue, 05 Nov 2019 13:30:59 GMT

Are you seeing this issue on other phones also, or only the S9+ ?

What security parameters are you using for the Peer Manager ? (See this link)

RE: Pairing issue | 0x3D MIC failure error

SK — Tue, 05 Nov 2019 09:25:03 GMT

1. I deleted the bond on the phone as well.

2. Samsung galaxy s9+

3. I did turn off and on again to test but problem persisted.

I have not tried using a different soft device yet, though :/

RE: Pairing issue | 0x3D MIC failure error

Sigurd — Tue, 05 Nov 2019 09:21:43 GMT

Did you delete the bond on the phone also ? What phone model is this? Could you try turning the phone off and on again ?

Is there any difference in the behavior if you use S132 v5.1.0 instead?

RE: Pairing issue | 0x3D MIC failure error

SK — Mon, 04 Nov 2019 05:07:24 GMT

Thanks a lot. But i already have had that function modified to what is suggested in the post.

RE: Pairing issue | 0x3D MIC failure error

skulkarni — Mon, 04 Nov 2019 05:01:24 GMT

https://devzone.nordicsemi.com/f/nordic-q-a/52034/sdk-15-3-pairing-issue

See if it helps you.

RE: Pairing issue | 0x3D MIC failure error

SK — Mon, 04 Nov 2019 02:24:48 GMT

UPDATE: I tried deleting the bonds with this function--> pm_peers_delete(), but problem still persists.

RE: Pairing issue | 0x3D MIC failure error

SK — Mon, 04 Nov 2019 01:07:44 GMT

Also, if this works, it still looks like a temporary solution. What if it happens in the future when the products are out with customers? How to eradicate this permanently?

RE: Pairing issue | 0x3D MIC failure error

SK — Mon, 04 Nov 2019 01:06:17 GMT

Hi, How do i remove the bond from the nRF? i tried erasing the chip assuming that will erase the bond as well from the nRF module.

RE: Pairing issue | 0x3D MIC failure error

Sigurd — Fri, 01 Nov 2019 15:58:34 GMT

Hi,

BLE_HCI_CONN_TERMINATED_DUE_TO_MIC_FAILURE could indicate that you are using incorrect encryption keys when you try to encrypt the link with a bonded device. Maybe the bonds were accidentally deleted on the phone. Try to remove the bond on both the phone and the nRF, and bond again.