https://devzone.nordicsemi.com/f/nordic-q-a/55440/nrf52840-wlcsp-routingTo the kind attention of Nordic support team, According to your valuable experience and manufacturers&#39; capabilities, having the package a pitch of 0.35 mm is it possible to route traces / fit vias between pads? Thank youen-USTelligent Community 13Tue, 10 Dec 2019 09:34:14 GMThttps://devzone.nordicsemi.com/thread/224636?ContentTypeID=1Tue, 10 Dec 2019 09:34:14 GMT137ad170-7792-4731-bb38-c0d22fbe4515:4e21f685-bc06-4092-b662-0d71a91ccb2dAndreas<p>Hi,</p> <p>&nbsp;</p> <p>This is something that you need to consult with your PCB fab, really. If they can support thin enough traces to route between pads there should not be any problem with this. As for vias between pads this is also fine if you make sure this does not degrade the grounding of the IC.</p> <p>&nbsp;</p> <p>Best regards,</p> <p>Andreas</p><div style="clear:both;"></div>