https://devzone.nordicsemi.com/f/nordic-q-a/57747/nrf52840-ckaa-ground-viaReferencing the recommended 52840 PCB layout for the WLCSP package, we noticed two thru-hole vias in the middle of the ground area (in the center of the package). Do these thru-hols vias create problems for the PCB manufacturing (bare board and SMT assemblyen-USTelligent Community 13Fri, 14 Feb 2020 02:16:40 GMThttps://devzone.nordicsemi.com/thread/234295?ContentTypeID=1Fri, 14 Feb 2020 02:16:40 GMT137ad170-7792-4731-bb38-c0d22fbe4515:c03c2f93-295c-4d3a-aea7-b57bbeb14af6Mike<p>Thank you, that makes sense. We will instruct the PCB shop to fill the through-hole vias to avoid wicking away the solder.</p><div style="clear:both;"></div>https://devzone.nordicsemi.com/thread/234185?ContentTypeID=1Thu, 13 Feb 2020 13:20:03 GMT137ad170-7792-4731-bb38-c0d22fbe4515:baaaa2ef-d41f-4a0c-a189-2cb33f982283ketiljo<p>The vias are filled. Else they will wick up the solder from the balls. As long as you are able to sufficiently ground the GND balls, it doesn&#39;t matter how you do it. You can use vias in the pads, as you would have to anyway to bring out the inner balls. The GND vias must connect to the ground plane directly. The reference layout used through hole vias because the ground plane is on the bottom side and the micro vias in the pads don&#39;t reach that far.</p><div style="clear:both;"></div>