https://devzone.nordicsemi.com/f/nordic-q-a/69353/single-layer-3-3-mil-fanout-of-the-inner-row-of-aqfn-packageI am designing a PCB for the nRF52833 aQFN chip. To reduce the cost of the PCB I would like to fanout the inner row of the IC package on a single layer by using 3/3mil traces, instead of using via in pad technology. According to my calculations this shoulden-USTelligent Community 13Fri, 11 Dec 2020 10:59:07 GMThttps://devzone.nordicsemi.com/thread/284488?ContentTypeID=1Fri, 11 Dec 2020 10:59:07 GMT137ad170-7792-4731-bb38-c0d22fbe4515:b59e8d5e-42c5-4627-b208-213f2175df57ketiljo<p>Sounds hard to do. You must check with your PCB supplier if that&#39;s ok or not.&nbsp;</p><div style="clear:both;"></div>