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<?xml-stylesheet type="text/xsl" href="https://devzone.nordicsemi.com/cfs-file/__key/system/syndication/rss.xsl" media="screen"?><rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:slash="http://purl.org/rss/1.0/modules/slash/" xmlns:wfw="http://wellformedweb.org/CommentAPI/" xmlns:atom="http://www.w3.org/2005/Atom"><channel><title>Themal resistance /nRF52840 WLCSP</title><link>https://devzone.nordicsemi.com/f/nordic-q-a/80755/themal-resistance-nrf52840-wlcsp</link><description>Hi, 
 Could you provide us with the thermal resistance of the nRF52840 WLCSP? We need it for the thermal analysis. 
 Thanks, 
 Shimada</description><dc:language>en-US</dc:language><generator>Telligent Community 13</generator><lastBuildDate>Tue, 19 Oct 2021 00:27:51 GMT</lastBuildDate><atom:link rel="self" type="application/rss+xml" href="https://devzone.nordicsemi.com/f/nordic-q-a/80755/themal-resistance-nrf52840-wlcsp" /><item><title>RE: Themal resistance /nRF52840 WLCSP</title><link>https://devzone.nordicsemi.com/thread/334703?ContentTypeID=1</link><pubDate>Tue, 19 Oct 2021 00:27:51 GMT</pubDate><guid isPermaLink="false">137ad170-7792-4731-bb38-c0d22fbe4515:c8504aca-17d4-4c15-ba1f-0bbedf08b124</guid><dc:creator>Taiyo shimada</dc:creator><description>&lt;p&gt;Dear Mr.Johansen&lt;/p&gt;
&lt;p&gt;&lt;/p&gt;
&lt;p&gt;Thank you for your answer.&lt;br /&gt;I am grateful for your speedy handling.&lt;br /&gt;With your response, my problem was solved.&lt;/p&gt;
&lt;p&gt;&lt;/p&gt;
&lt;p&gt;Thanks,&lt;/p&gt;
&lt;p&gt;Shimada&lt;/p&gt;&lt;div style="clear:both;"&gt;&lt;/div&gt;</description></item><item><title>RE: Themal resistance /nRF52840 WLCSP</title><link>https://devzone.nordicsemi.com/thread/334648?ContentTypeID=1</link><pubDate>Mon, 18 Oct 2021 13:54:37 GMT</pubDate><guid isPermaLink="false">137ad170-7792-4731-bb38-c0d22fbe4515:f265708e-615f-4035-88bb-25f20981a544</guid><dc:creator>ketiljo</dc:creator><description>&lt;p&gt;Dear Mr. Shimada&lt;/p&gt;
&lt;p&gt;Junction to ambient thermal resistance for a a typical QFN package is 40-50 &lt;span&gt;°C/W. The CSP package will have a higher value, maybe as much as 100&amp;nbsp;°&lt;span style="background-color:rgba(255, 255, 0, 1);font-weight:bolder;"&gt;C/W&lt;/span&gt; depending on the size of the ground plane, vias etc. Most of the heat dissipation&amp;nbsp;will take place via the ground balls and the ground plane.&amp;nbsp;&lt;/span&gt;&lt;/p&gt;
&lt;p&gt;&lt;span&gt;&lt;/span&gt;&lt;/p&gt;
&lt;p&gt;&lt;span&gt;best regards,&lt;/span&gt;&lt;/p&gt;
&lt;p&gt;&lt;span&gt;Ketil Aas-Johansen&lt;/span&gt;&lt;/p&gt;&lt;div style="clear:both;"&gt;&lt;/div&gt;</description></item></channel></rss>