https://devzone.nordicsemi.com/f/nordic-q-a/87146/recommended-footprint-nrf9160Hi, The Evaluation board seems to have a footprint for nRF9160 non conventional. The middle on TopLayer is a sort of Grid connected to the GND and Track to link Vias t Inner GND Plane. Is this sort of connection recommended for some reason?en-USTelligent Community 13Sat, 09 Dec 2023 22:03:18 GMThttps://devzone.nordicsemi.com/thread/459598?ContentTypeID=1Sat, 09 Dec 2023 22:03:18 GMT137ad170-7792-4731-bb38-c0d22fbe4515:857e04c5-c99a-41f2-9935-577dd7fe5149Timaxusa<p>Did you guys end up finding solution?&nbsp;</p><div style="clear:both;"></div>https://devzone.nordicsemi.com/thread/364433?ContentTypeID=1Fri, 22 Apr 2022 10:48:26 GMT137ad170-7792-4731-bb38-c0d22fbe4515:a9ca36ea-9190-47b8-83a0-27de0b62f873ketiljo<p>There&#39;s no other reason for the grind under the module than to improve solderability as a ground plane may take more time to heat properly. If you solder process allows for it, is should be ok.&nbsp;</p> <p>The aperture for the paste stencil may need reduction, depending on the thickness of the stencil and the process.&nbsp;</p><div style="clear:both;"></div>https://devzone.nordicsemi.com/thread/364191?ContentTypeID=1Thu, 21 Apr 2022 11:00:40 GMT137ad170-7792-4731-bb38-c0d22fbe4515:e5ced3e6-6c9b-4b3f-830a-4e849c3f72eeCraig12<p>I&#39;m also interested to hear a response from Nordic on these questions. We did a small pilot run of 50 boards last year using the Altium Designer footprint provided in PCA10090-nRF9160 Development Board 1_0_0.&nbsp; Our thoughts are the solder paste apertures for the internal 5 x 7 grid was too large and was effecting our yield.</p><div style="clear:both;"></div>