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<?xml-stylesheet type="text/xsl" href="https://devzone.nordicsemi.com/cfs-file/__key/system/syndication/rss.xsl" media="screen"?><rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:slash="http://purl.org/rss/1.0/modules/slash/" xmlns:wfw="http://wellformedweb.org/CommentAPI/" xmlns:atom="http://www.w3.org/2005/Atom"><channel><title>Pre-tin a QFN chip?</title><link>https://devzone.nordicsemi.com/f/nordic-q-a/97463/pre-tin-a-qfn-chip</link><description>Hello, we use the nRF52840 in the aQFN 73 package, 7 x 7 mm. Seeing some production failures with the boards. Examined several boards under robotic X-ray and there are several questionable solder joints around the nRF chip. The assembly house is recommending</description><dc:language>en-US</dc:language><generator>Telligent Community 13</generator><lastBuildDate>Wed, 08 Mar 2023 14:53:32 GMT</lastBuildDate><atom:link rel="self" type="application/rss+xml" href="https://devzone.nordicsemi.com/f/nordic-q-a/97463/pre-tin-a-qfn-chip" /><item><title>RE: Pre-tin a QFN chip?</title><link>https://devzone.nordicsemi.com/thread/414182?ContentTypeID=1</link><pubDate>Wed, 08 Mar 2023 14:53:32 GMT</pubDate><guid isPermaLink="false">137ad170-7792-4731-bb38-c0d22fbe4515:374d0a5f-6614-455f-89ab-50e6602e34dc</guid><dc:creator>ketiljo</dc:creator><description>&lt;p&gt;Hi MIchael&lt;/p&gt;
&lt;p&gt;I have never come across the need for this before. I suggest that they check the solder profile and amount of solder paste on the pads first. Please take a look at this whitepaper:&amp;nbsp;&lt;a href="https://infocenter.nordicsemi.com/topic/nan_040/APP/nan_040/nan40_intro.html?cp=17_"&gt;https://infocenter.nordicsemi.com/topic/nan_040/APP/nan_040/nan40_intro.html&lt;/a&gt;&lt;/p&gt;
&lt;p&gt;&lt;/p&gt;
&lt;p&gt;Best regards,&lt;/p&gt;
&lt;p&gt;Ketil Aas-Johansen&lt;/p&gt;&lt;div style="clear:both;"&gt;&lt;/div&gt;</description></item></channel></rss>