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Unable to bond when using the bootloader

Hi, I'm trying to use the example bootloader with the new NRF52, everything seems to work fine except that I'm unable to bond to the device when the bootloader is installed. The same test HRS application bonds just fine when the bootloader is not installed.

These are the Master Control Panel logs:

As I can see on the log, when trying to bond it receives an HCI EventCode 0x0A which is described on the BT spec as: SYNCHRONOUS CONNECTION LIMIT TO A DEVICE EXCEEDED. I've been struggling with it for hours but I've been unable to find a solution so any help would be appreciated.

Test scenario:

  • Flash s132_nrf52_1.0.0-3.alpha_softdevice.hex
  • Flash dfu_test_bootloader_b.hex
  • Install dfu_test_app_hrm_s132.zip through the MCP
  • Start discovery, connect and try to bond

Thank you

EDIT: I just noticed it throws a 0x0D HCI event code before the 0x0A:

[480113664][ScriptMethodCallThread] TST-Client: Discarded <HciEvent: eventCode=0x0D> - <HciEvent: eventCode=0x0D>

This one is described as "Connection Rejected Due To Limited Resources".

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