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Bonding is working only first time

I am working in sdk12.2 nrf52832 . When build and run the project it will work smoothly with ble connectivity... But the problem is it will bond only once when the softdevice is just burned... I am using eclipse for programing. When it uses device manager for bond it works perfectly.. but when it is replaced by peer manager the problem will starts... Only after re burning the softdevice will solve the problem... Please help me

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