Hi,
I am using the ble_gls_app provided in the SDK 8.1. Also i am using S110 softdevice v8.0.
When i am trying to bond through MCP it is asking for a passkey. How can i disable that feature?
Thanks & Regards, Sumit
Hi,
I am using the ble_gls_app provided in the SDK 8.1. Also i am using S110 softdevice v8.0.
When i am trying to bond through MCP it is asking for a passkey. How can i disable that feature?
Thanks & Regards, Sumit
Hi, to remove this security requirement, change the following defines in main.c:
SEC_PARAM_MITM from '1' to '0'
SEC_PARAM_IO_CAPABILITIES from BLE_GAP_IO_CAPS_DISPLAY_ONLY to BLE_GAP_IO_CAPS_NONE
Hi,
I made the following changes. An tried to bond the device through Master Control Panel. But it says BTLE_Connection_Timeout and received link loss. It doesnt bond with the device. Is this the expected behaviour?
Thanks
Hi,
I made the following changes. An tried to bond the device through Master Control Panel. But it says BTLE_Connection_Timeout and received link loss. It doesnt bond with the device. Is this the expected behaviour?
Thanks