Hi nordic:
I would like to inquire about the foundry, packaging, testing, ball-mounting, and process node (e.g. 28nm, 40nm, etc.) for the 52832 chip.
(Writing an internal application guide requires detailed information to introduce the product.)
THX
Hi nordic:
I would like to inquire about the foundry, packaging, testing, ball-mounting, and process node (e.g. 28nm, 40nm, etc.) for the 52832 chip.
(Writing an internal application guide requires detailed information to introduce the product.)
THX
Hi,
Those info can be found here.
https://www.nordicsemi.com/Products/nRF52832/Download#infotabs
https://docs.nordicsemi.com/bundle/nRF52832_PS_v1.9/resource/nRF52832_PS_v1.9.pdf -> chapter 4 Pin assisgnment -> ball assignment
The nRF52832 is based on a 40 nm process node.
Whether there is a bit of glue required, stress glue or waterproof glue ?
I do not think we mandate any such requirement as that depends on the use of your product and what kind of stress test you want it to go through.