Hi
I'm testing the current consumption of the external qspi-flash on nrf5340dk [MX25R6435F]. I have used ppk 2 to measure consumption with the dk and also have used a power monitor with a nrf5340 soc(custom breakout board) + flash setup.
I've not made any changes to the dts files. My application performs some flash write operations and uses pm_device_action_run to suspend the flash.I then check the state of the flash through the pm state get api's - which indicate the flash is suspended.
In both the cases(ppk and power moitor) the current to the flash in deep power down mode is in the order of 800-900 uA, i.e the same as during flash write operations. Which indicates that the flash has not been able to go to dpd mode successfully.
There is however one thing I had noticed in the nrf qspi driver code, the datasheet of the flash specifies to pull up the cs pin at the byte boundary after the cmd is sent, the driver code however after sending the command, waits for the period of time the flash takes to go into dpd mode (10us) and then puts the qspi pins in the sleep mode after performing uinit of qspi. Is the pulling high of cs pin handled somewhere else and I have missed something?
If the above observation is irrelevant then why is the flash drawing such high current in dpd mode?
