I am a manufacturing engineer from Jabil circuit de Mexico, we have issues in the thermal pad or ground pad whit next mrf part number: NRF52833-QDAA-R, I would like to know if could be possible provide me the reflow profile and the foot print recommendations, our %void are 40 to 50 about.
We put the maximum volume of paste that its possible according with aspect ratio in the signal pines.