Voids and insufficiencies

[Manuel Pardo]

I am a manufacturing engineer from Jabil circuit de Mexico, we have issues in the thermal pad or ground pad whit next mrf part number: NRF52833-QDAA-R, I would like to know if could be possible provide me the reflow profile and the foot print recommendations, our %void are 40 to 50 about. 

We put the maximum volume of paste that its possible according with aspect ratio in the signal pines.

[Susheel Nuguru]

Hi Manuel, 

The person who could help with this is away for summer vacation and is back in two weeks. Will get back to you when he is back to work. Thanks for your understanding.