nRF52833 aQFN package

Hi, 

We are having issues with this part bridging on our via-in-pads.  We are using 2oz finished outer layer copper. 

Do you have any footprint recommendations for 2oz copper? 

We are thinking of making the via-in-pads solder mask defined. Would it be better to only make the via in pads solder mask defined or to make all of the pads solder mask defined?

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