Hi,
I’m currently testing the update process via BT SMP on the matter window covering example (NCS 3.0.2, nrf5340). For my test, I created two versions:
1. Project with -DCONFIG_CHIP_DFU_OVER_BT_SMP=y enabled
2. Modified project with an additional log message and also -DCONFIG_CHIP_DFU_OVER_BT_SMP=y enabled
Test procedure:
1. Flash Version 1 onto the device
2. Perform a BT SMP update to Version 2 using the Android app (v4.29.1)
3. Commission the device using chip-tool (TH 1.4 on Raspberry Pi 4)
When I try to commission the device via chip-tool, I get the following error:
However, if I flash Version 2 directly onto my board using JLink, commissioning via chip-tool works as expected and I can control the device. It seems that updating via BT SMP is causing some parts to be overwritten, which then prevents commissioning.
Do you have any idea what settings could be responsible for this? How can I fix this issue in my project?
I’m currently testing the update process via BT SMP on the matter window covering example (NCS 3.0.2, nrf5340). For my test, I created two versions:
1. Project with -DCONFIG_CHIP_DFU_OVER_BT_SMP=y enabled
2. Modified project with an additional log message and also -DCONFIG_CHIP_DFU_OVER_BT_SMP=y enabled
Test procedure:
1. Flash Version 1 onto the device
2. Perform a BT SMP update to Version 2 using the Android app (v4.29.1)
3. Commission the device using chip-tool (TH 1.4 on Raspberry Pi 4)
When I try to commission the device via chip-tool, I get the following error:
Error on commissioning step 'SendAttestationRequest': 'IM Error 0x00000501: General error: 0x01 (FAILURE)'However, if I flash Version 2 directly onto my board using JLink, commissioning via chip-tool works as expected and I can control the device. It seems that updating via BT SMP is causing some parts to be overwritten, which then prevents commissioning.
Do you have any idea what settings could be responsible for this? How can I fix this issue in my project?
