Platform : NRF54L15
NCS(2025.9): 3.0.2
NCS(2025.10): 3.1.1 Commit: e2a97fe2578a
Zephyr: 4.1.99 Commit: ff8f0c579eeb
Cause of the issue
Earlier, when I were producing products (around 600 units with 2025.9), about 30% of the chips had difficulty connecting. Later, it was found that the boards that disconnected immediately after connecting were stuck at "MPSL ASSERT: 109, 585."
At that time, the SDK used was 3.0.2. After consulting AI, He was advised to increase CONFIG_MPSL_HFCLK_LATENCY to 1400-1650. The original SDK default was 845, and after I increased it to 1000, the connection yield of the product improved. However, the actual use was still not very stable.
Until the 3.1.0 update in October 2025, which mentioned optimizations related to MPSL, I updated the SDK to 3.1.1. The actual use was indeed much more stable than 3.0.2, but "MPSL ASSERT: 109, 585" still occasionally occurred.
I think the assertion scenario may be due to the following two possibilities:
1. My system has long delay blocking, which may currently be reflected in the regular operation of RRAM in my system, such as writing logs to RRAM once per second, or writing to external norFlash.
I have also evaluated the interface delay for writing to RRAM. The schemes are NVS > ZMS > RRAM single. Since using the system storage management scheme may cause uncontrollable and mysterious delays, I ended up directly operating on RRAM single.
2. The SDK 3.1.1 has not completely fixed the MPSL temperature drift issue.
