nRF5340-CLAA solder process

[Matt Callicoat]

We have a manufacturing project assembling the 0.35mm CSP package. We would like guidance on part handling, solder stencil specifications and any other process steps that impact the solderability of the fine pitch package.

[Bendik Heiskel]

Hi,

For the WLCSP package we have a handeling guidelines whitepaper available here:
https://docs.nordicsemi.com/bundle/nan_38/resource/nan_38.pdf

We don't have any specific solder stencil requirements, as this is heavily dependent on the process used by your PCB manufacturer. For our DKs and internal test boards we rely on the expertise of the  manufacturers we're using, and let them handle modifying the solder stencil for the process they are using. For reference our manufacturers are usually using 80 - 100 um stencils.

 

Best regards,

Bendik