nRF54L15-CAXX WLCSP Package Solder Balls

[Cindy K]

I have a question regarding the solder balls on the WLCSP package of this device. Are they collapsing or non-collapsing? Can you also provide a definitive source for this answer?

[Priyanka]

Hi Cindy,

I am checking this internally and will get back to you.

-Priyanka

[Cindy K]

Many thanks, Priyanka. We are interested in the possibility that there is a reflow profile that keeps the balls from collapsing, 

Do we need to follow the reference design in regard to the size of the BGA pads, or is it permissible to enlarge them (to 8.5 mils in this instance)?

[Priyanka]

I think you need to follow the reference design recommendations for these.

Nevertheless I will check this as well with the team.

-Priyanka