The Nordic Hardware Design Guidelines suggest a 0.050 mm soldermask clearance around the pads which should give a 0.100 soldermask sliver between the pads according to the documentation. Using a 0.050 clearance however actually results in a 0.050 mm sliver between the pads and not the desired 0.100 mm.
Is it acceptable to reduce the 0.050 clearance to 0.025 in order to achieve the desired 0.100 sliver dimension?
I am particularly focused on the pads around the periphery of the device that have dimensions of 0.5mm x 0.35 mm. The footprint is supplied from the Altium Content Vault