In nutshell, I intend to achieve
Buttonless DFU over BLE on a custom board with SDK v10.0.0 and Softdevice v8.0.0 with bonding retained.
On this custom board, there are neither any buttons nor any external clock, hence I had to make corresponding changes in the sample bootloader (that comes with SDK v10.0.0) and in my application. Currently DFU over BLE is working (triggering DFU from bootloader and/or triggering DFU from the application), but the bonding is getting removed after DFU is completed (see the snip from the MCP logs below)
A 16:11:58.706 [DFU] Activate and Reset request sent
I 16:11:58.949 [DFU] Disconnected by the remote device
D 16:11:58.976 [DFU] gatt.refresh() (hidden)
D 16:11:59.102 [DFU] gatt.close()
V 16:11:59.150 [DFU] Removing bond information...
D 16:11:59.183 [DFU] gatt.getDevice().removeBond() (hidden)
D 16:11:59.244 [Broadcast] Action received: android.bluetooth.device.action.ACL_DISCONNECTED
D 16:11:59.299 [Broadcast] Action received: android.bluetooth.device.action.BOND_STATE_CHANGED, bond state changed to: BOND_NONE (10)
I 16:11:59.335 Bond information deleted
Enviornment:
- SD: v8.0.0
- SDK: v10.0.0
- SOC: nrf51822QFAA
- SOC IC revision: 2
- Central Application for testing DFU BLE: Nordic's Android phone app, MCP
According to the Compatibility matrix, IC revision 2 is not supported on SDK v10.0.0, but I was told by a Nordic Employee in this thead , that IC revision 2 could also work with SDK v10.0.0 and such efforts are best left to the customers to validate. So, I started porting the application (Bond sharing between Bootloader and Application was not possible with sdk v6.1.0 and SD v7.1.0). The application was ported fine and I did some basic connectivity, and services related tests and it worked well. Now during the DFU over BLE, I face this problem of bonding getting deleted. I suspect the problem is with firmware and not with the IC compatibility issue.
I've set the memory settings for Bootlader in KEIL MDK5 Toolchain, according to this thread and is as follows:
IROM1 Start: 0x0003C000 Size: 0x3C00
IRAM1 Start: 0x20002C00 Size: 0x1380
IRAM2 Start: 0x20003F80 Size: 0x80 (NoInit Checked)
And, Memory settings for application in Keil MDK5 Toolchain:
IROM1 Start: 0x18000 Size: 0x28000 (Total 256 kB main flash memory)
IRAM1 Start: 0x20002000 Size: 0x4000 (Total 16 kB of RAM)
Some code snips from Application:
// 1: Retain bonding
bool erase_bonds = false;
device_manager_init(erase_bonds);
// 2: Low frequency internal clock source to be used by the SoftDevice
#define NRF_CLOCK_LFCLKSRC NRF_CLOCK_LFCLKSRC_RC_250_PPM_250MS_CALIBRATION
void ble_stack_init()
{
............
SOFTDEVICE_HANDLER_INIT(NRF_CLOCK_LFCLKSRC, NULL);
............
}
// 3: Allow service change characteristics
#define IS_SRVC_CHANGED_CHARACT_PRESENT 1
In the bootloader, same clock source (NRF_CLOCK_LFCLKSRC_RC_250_PPM_250MS_CALIBRATION) is used in ble_stack_init() and I have commented out following two lines in sample Bootloader code:
// buttons_init(); /* No buttons on this custom board */
// dfu_start |= ((nrf_gpio_pin_read(BOOTLOADER_BUTTON) == 0) ? true: false); /* no use */
and Service changed characteristic is also set to '1':
// Allow service change characteristics
#define IS_SRVC_CHANGED_CHARACT_PRESENT 1
Setup for "dfu_ble_svc.c" in the bootloader project configuration:
The complete DFU logs collected using nRFLog is attached here.
Has someone seen such behavior ? and how to fix this issue ? My gut feeling is that this is not a IC compatibility issue and I'm probably missing something important in the firmware side.
Please suggest.
Update: 27.05.2019
Attaching central and peripheral logs (please refer my last comment)
Central logs: dfu_central_logs.txt
Peripheral logs: dfu_peripheral_logs.txt
