High temperature survival during device manufacturing

[Jean-Marc Koller]

Hi,

We are currently considering the packaging design of a device which will use a nRF52. During housing assembly, the populated, but unpowered, PCB will be exposed to a temperature of 170°C during 30 minutes.

This is higher than the absolute maximum rating of 125°C specified within the data-sheet regarding the storage temperature! May an exposition to high temperature during a limited duration still be acceptable? May the reliability of the flash be reduced? Shall we foresee a re-programming cycle of the flash after the assembling?

[run_ar]

You can find our QFN soldering guidelines here. And our WLCSP Handling guidelines here. Exposing the device to high temperatures outside of what is described in these documents is out of spec, and we cannot guarantee for their operation anymore.