Hi, I am trying to get bonding to work in both iOS and Android versions. As per the suggestion in : devzone.nordicsemi.com/.../ I used attr_md.read_perm.sm=1; attr_md.read_perm.lv=2; attr_md.write_perm.sm=1; attr_md.write_perm.lv=2;
BLE_GAP_CONN_SEC_MODE_SET_ENC_NO_MITM(&attr_md.read_perm);
BLE_GAP_CONN_SEC_MODE_SET_ENC_NO_MITM(&attr_md.read_perm);
instead of
memset(&attr_md, 0, sizeof(attr_md));
BLE_GAP_CONN_SEC_MODE_SET_OPEN(&attr_md.read_perm);
BLE_GAP_CONN_SEC_MODE_SET_OPEN(&attr_md.write_perm);
to force the iOS to bond. But, if I do so, some Android phones(MotoG, Samsung Galaxy S7) do not connect with the firmware (while iOS and some other Android phones(Samsung Galaxy S6(Android ver: 5.1.1); Nexus5 (Android version: 4.4.4), Samsung Galaxy S4(Android version: 5.0.1)) do work properly). I am using SDK 10.0.0 S130 on nRF51822xxaa. Sorry, we are not in a position to try out SDK 11 at this point of the project (almost ending stage).
