nRF51-ble-peripheral-bond-handling

[thischier]

Hello

I've found your example in the dev-zone and migrate the project to SDK10 and will probably do the same for SDK11.

However, I've got a problem in my project. When I use your code and bond several devices, everything works as expected. I can see that the device manager erases old bonds to make place for newer ones as soon as I reach the MAX_BONDS value.

My project also uses DFU and there is where I get all my problems. As soon as I upload a new firmware to my device, I can see that the Device Manager starts up as it should and I can also see the different context for the already paired devices. Unfortunately my device freezes afterwards.

Therefore I would like to know if you have tested the example on git also with a bootloader?

Many thanks for your assistance.

Br thierry

[thischier]

I've made several tests. I bonded the first smartphone and re-programmed my device. After launching the firmware, everything worked as expected. I repeated this procedure several times and after I've bonded the 6 smartphone, my device freezes after the upload of the firmware. I compiled the project with debug and got a hard fault error.

I added the call stack to this answer, but you can see that I get the hardfault when I start an app_timer...