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nRF51-ble-peripheral-bond-handling

Hello

I've found your example in the dev-zone and migrate the project to SDK10 and will probably do the same for SDK11.

However, I've got a problem in my project. When I use your code and bond several devices, everything works as expected. I can see that the device manager erases old bonds to make place for newer ones as soon as I reach the MAX_BONDS value.

My project also uses DFU and there is where I get all my problems. As soon as I upload a new firmware to my device, I can see that the Device Manager starts up as it should and I can also see the different context for the already paired devices. Unfortunately my device freezes afterwards.

Therefore I would like to know if you have tested the example on git also with a bootloader?

Many thanks for your assistance.

Br thierry

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  • Hi Thierry,

    Sorry that I was in a business trip so couldn't answer quickly. I'm back now.

    Could you please edit your question and add the modified project that you are testing and the bootloader you used. So I can try here ? Also please test with the default example from SDK v10 or SDKv11 to check if the same issue happens ?

    Could you step into the app_timer_start and check which call caused the hardfault, I don't see a reason why app timer can cause hardfault.

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  • Hi Thierry,

    Sorry that I was in a business trip so couldn't answer quickly. I'm back now.

    Could you please edit your question and add the modified project that you are testing and the bootloader you used. So I can try here ? Also please test with the default example from SDK v10 or SDKv11 to check if the same issue happens ?

    Could you step into the app_timer_start and check which call caused the hardfault, I don't see a reason why app timer can cause hardfault.

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