Hi nordic engineer:
I want to know the right process to delete the bonds when the device connected.
There is a button used for bonding. When it pressing by more than 3 seconds, it should go into a bond process, no matter it was connected or not.
I got a app_error_handler() under connected.
Here is my operation:
app_sched_execute();
power_manage();
if(bind_info_clear == true)
{
err_code=sd_softdevice_disable();
APP_ERROR_CHECK(err_code);
// Re-initialize
bond_manager_init();
ble_stack_init();
advertising_init(BLE_GAP_ADV_FLAGS_LE_ONLY_LIMITED_DISC_MODE);
advertising_start();
bind_info_clear = false;
}
It must stop the ble first so I disable the softdevie(is it correct?), then delete the bond flash, and re-init the ble stack to enable the softdevice(or need to call sd_softdevice_enable()?), after that, re-start the advertising...
I am confuse on how to disconnect the ble and stop it when doing the flash operation.
If there is any example for this application should be better...
Thanks. Jim