Hi I note here that it is recommended to apply solder mask to the ground layer beneath the nRF24L01+ exposed die so they don't connect:
But in the gerber files from the eval kit download, if I'm reading them right, the vias don't have solder mask? So don't they risk making a connection?
Also, I see here that someone got a reply from Nordic saying the recommendation has now relaxed and that soldering to a ground pad, with additional vias, is fine:
Is this the latest recommendation?
Thanks, Joe