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nRF24L01+ solder mask vias

Hi I note here that it is recommended to apply solder mask to the ground layer beneath the nRF24L01+ exposed die so they don't connect:

devzone.nordicsemi.com/.../

But in the gerber files from the eval kit download, if I'm reading them right, the vias don't have solder mask? So don't they risk making a connection?

Also, I see here that someone got a reply from Nordic saying the recommendation has now relaxed and that soldering to a ground pad, with additional vias, is fine:

electronics.stackexchange.com/.../what-are-reasons-for-not-connecting-exposed-pad-ep-thermal-pad-to-ground

Is this the latest recommendation?

Thanks, Joe

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