It is recommended you copy the entire layout surrounding the chip and RF output as shown in the product specification chapter 46.4. This is to ensure as stable operation as possible.
The most sensitive part of the layout would be at the RF output as even small changes can severely affect performance and range.
You should also ensure a good connection between ground and center-pad, preferably with vias underneath the chip.
You should also avoid routing traces underneath the XTAL crystals.
If you have a layout or schematic design you want us to review feel free to create a DevZone case with your project files, or images of your design. If your design is confidential you can create a mypage case at nordicsemi.com.
It is recommended you copy the entire layout surrounding the chip and RF output as shown in the product specification chapter 46.4. This is to ensure as stable operation as possible.
The most sensitive part of the layout would be at the RF output as even small changes can severely affect performance and range.
You should also ensure a good connection between ground and center-pad, preferably with vias underneath the chip.
You should also avoid routing traces underneath the XTAL crystals.
If you have a layout or schematic design you want us to review feel free to create a DevZone case with your project files, or images of your design. If your design is confidential you can create a mypage case at nordicsemi.com.
