I test ble bond with 'ble_app_gls' in sdk 12.3.0
eg.nRF5_SDK_12.3.0_d7731ad\examples\ble_peripheral\ble_app_gls\pca10028\s130\arm5_no_packs
my phone is meizu mx4, android 5.1, another one is coolpad 8690, android 4.4.2, test app is nRF Connect, board is pca10028.
On communication with Android device sometimes the link disconnects with disconnection reason61(0x3D) - BLE_HCI_CONN_TERMINATED_DUE_TO_MIC_FAILURE.
who can help me? thanks!