szenario beacon and receiving nodes are all MCU based and all powered by net, no local battery needed the beacon usually located near the floor, the nodes will be located in the roofs distances between beacon and nodes : up to 10 or 30 mtrs, depending the cases 1 emitting beacon will have N receiving nodes : no map of at the beacon of the receiving nodes id 1 receiving node will get at least 1 beacon packet, some nodes will get packets from 2 or more beacons the beacon and nodes will be configured from a smartphone
question : pcb related suggested chip for beacon and node how many layers in the pcb power supply quality : ripple, .. antenna options for up to 30 mtr in the pcb or external if possible, 868/915 Mhz the data to be transferred is really low : usually only 1 packet per send
questions : interferences with lamp covers in the roofs, humidity, moisture use of BLE is reliable in a shopfloor environment ? effects of high humidity on BLE convenient % reduction to be applied to the max distance based on such factors are known risks if the BLE pcb contains, too, the driver of the led ?
question : info about usual comm problems with BLE list of things to be taken in account when using BLE comm in 10 – 30 mtr distances
question : box of the lamp driver convenient material of the box when lamp with embedded driver or simply protect the chips with silicon or epoxy ?
question : profiles to be applied in the nodes and beacon when in beacon mode (send and receive) when in config editing mode when in file transfer (exe update)
question : profiles to be applied in the smartphone app
question : time control is possible to get reliable time intervals with a BLE SoC with an RTC component inside the pcb ?
question : libraries comm library in C ?
my best regards