Procedure difference of Bluetooth SIG exists when using BLE module/creating custom PCBs?

Question

Hi there~. I was working on a BLE RC car (BLE peripheral) using Nordic's nRF52832-QFAA MCU , Nordic's UART Service for motor control, and Battery Service (BAS) for battery level notification. 
 After prototyping, the time has come to manufacture! My company planned to create 2K units of RC Cars and each one has a single nRF52 MCU. But I haven't noticed the SIG certification. I was concerned whether to create a custom PCB that has a PCB antenna and nRF52832-QFAA or choose a BLE module. Later, I noticed BLE module vendors like Laird informed that their BLE modules have the declaration ID and Qualified Design ID (QDID). 
 
 For instance, Laird's BL652 SERIES have FCC, IC, CE, MIC and Bluetooth SIG approvals. They noted their SIG Certification that the this is an "End Product" with QDID 98795 . I used this URL to search the ID. 
 QUESTION: I hope I understood correctly. If I use these certified (Product type == End product, QDID registered in SIG, End Product Listing EPL) BLE modules from those vendors, my RC car doesn't need the SIG certification since the module itself is certified, right? Whereas if I create a custom PCB that uses nRF MCUs, I, or the company where I work, have to handle the SIG certification, correct? 
 Or if I follow the PCB design of the nRF52-DK (FR-4 1.6mm thick 2-layered PCB, copy the antenna design and IC placements, and more) when creating a custom nRF PCB, can this exempt my custom PCB from SIG certification? 
 The SIG price looked too overwhelming so I wish to make a smart choice before moving on. Depending on the manufacturing quantity, I think choosing a BLE module might be better. But I hope I was thinking the right way. Thanks for your time checking this! 
 !!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!! I added a picture for clearer explanation! 
 
 PIC: A PCB that has mounted a Bluetooth module from Laird.

Hung Bui · Accepted Answer

Hi Matthew, 
 I don't think you can get away from paying Bluetooth SIG to get Declaration ID by using Laird module.
As stated here and here : 
 Path 1: Qualification Process with No Required Testing (Declaration Process):
Using someone else's Bluetooth module in your product without any changes or additions 
Adding your logo to a complete product manufactured by a third party
 
 You may not need to do RF-PHY retest if you use the module. When you develop your own PCB, you will need to do RF-PHY retest, but not other qualification that we already provided with our QDID. 
 You only can get away from RF-PHY retest if you use exactly the same PCB as the nRF52 DK, including other components such as the Segger chip and headers, etc. 
 If your company is a start up and has a total revenue of less than $1mil you can apply for Innovation Incentive Program and pay less fee for qualification. 
 Also be aware that you can declare multiple product in one DID. Please check the Bluetooth Sig web page.