Is there a nordic guide which lists out the steps taken by the chip when going though a bonding process? I am trying to add as many RTT printouts as possible to know where the process is failing at.
Is there a nordic guide which lists out the steps taken by the chip when going though a bonding process? I am trying to add as many RTT printouts as possible to know where the process is failing at.
Hi Jon!
You can take a look at these message sequence charts (Softdevice s132).
Maybe this is the most relevant for you.
You can also take a look at the HRS example in our SDK, which handles bonding.
Best regards,
Joakim.
Hi Jon!
You can take a look at these message sequence charts (Softdevice s132).
Maybe this is the most relevant for you.
You can also take a look at the HRS example in our SDK, which handles bonding.
Best regards,
Joakim.