I have just updated to the latest SDK, including the S110 Soft device v7.0.0.
I have now noticed that I can bond using the Master Control Panel, but I cannot bond using 'Manage Bluetooth devices' in Windows 8.1. It fails telling me to try again or check with the manufacturer...
I therefore reached for the nRF sniffer package and downloaded that on to one of my PCA10000s. This showed me the difference between the two methods of bonding with the device, BUT it also showed me that the v7.0.0 Soft device was producing malformed packets. Something that would clearly affect any BLE communications. The malformed packets are only some of the ADV_IND packets. Looking at the erroneous packets the adverts have not been overwritten in the nRF51's memory, because the advert is transmitted correctly sometimes and when there are errors they vary across the packet. (N.B.I am flashing an LED whilst this is going on and my board is USB powered. )
I then went back and reflashed my old application and the v6.0.0 soft device and these errors disappeared.
My application is based upon the ble_app_hrs examples, and these are quite different between the two SDKs so my applications are a bit different too.
Is this a known issue? are others having this problem?
I have also noticed that the Windows BLE stack queries the v6 S110 for the bluetooth version, whilst for the v7 S110 the Windows BLE stack does not query this and goes straight to requesting MITM connection, followed by a non-MITM connection.
I was initially trying to evaluate the differences in bonding, but the number of malformed packets has caused me to want to clean this issue up first. Please can anyone help?
